No ka hōʻoia ʻana i ka pae kiʻekiʻe o ka maikaʻi, ʻo ka 12-layer rigid-flex circuit board e hana i kahi kaʻina kūikawā i kapa ʻia ʻo ka mālama ʻana i ke gula immersion. ʻAʻole kēia hoʻomaʻamaʻa e hoʻonui i ke ʻano holoʻokoʻa o ka papa, akā hāʻawi pū kekahi i ka pale maikaʻi loa mai ka oxidation a me ka corrosion. Hoʻohui ka lāʻau lapaʻau gula immersion i kahi papa o ka hilinaʻi i ka papa kaapuni, e hōʻoia ana i ka lōʻihi o ka ola a me ka hana paʻa.

Hoʻohui ʻia, loaʻa kēia mau papa i nā koho mānoanoa keleawe like ʻole, me 18um a me 35um. Hoʻoholo ka mānoanoa keleawe i ka hiki ke lawe i kēia manawa a me ka hiki ke hoʻopau wela o ka papa. Ma ka hāʻawi ʻana i nā koho mānoanoa keleawe he nui, hāʻawi nā mea hana i nā mea kūʻai aku i ka maʻalahi e koho i ke koho kūpono loa no kā lākou noi kikoʻī.

ʻO ka 12-layer rigid flex circuit board e hele i kahi kaʻina hana kūikawā i kapa ʻia ʻo high-density interconnect (HDI). Kōkua ʻo HDI i ka hoʻoikaika ʻana i ka hiki o ka hoʻokele ʻana o kēia mau papa, e hoʻonui ai i ka nui o ke kaapuni a me ka hoʻouna ʻana i nā hōʻailona. ʻO kēia kaʻina hana kūikawā e hōʻoia i kēia mau papa i nā koi koi o nā noi hana kiʻekiʻe.

Ma waho aʻe o kā lākou mau pono ʻenehana, ua pili pū kēia mau papa i ke kaiapuni. Hana ʻia lākou mai nā mea i loaʻa ʻole nā ​​mea ʻino a hoʻokō i nā kūlana kaiapuni honua. Ma ke koho ʻana i kahi papa kaapuni rigid-flex 12-layer, ʻaʻole koho wale nā ​​​​mea kūʻai aku i ka ʻenehana ʻokiʻoki, akā kōkua pū kekahi i ka wā e hiki mai ana.

ʻO ka hōʻuluʻulu ʻana, ʻo ka 12-layer rigid-flex circuit board me ka hoʻohana ʻana i ka ʻenehana hole makapō HDI a me ka hoʻomaʻamaʻa ʻana i ke gula immersion he mea hou i ka hana o nā papa kaapuni kiʻekiʻe. ʻO kona ʻano maʻalahi, ka hoʻolālā pololei a me ka hana akamai i koho maikaʻi loa no nā ʻano noi. Ke hōʻike nei i ka pono hōʻailona kiʻekiʻe, nā mana ala ala kiʻekiʻe a me kahi kaʻina hana hoʻonaninani, ʻo kēia mau papa he hōʻike i ka holomua ʻenehana a me ka hoʻomau.