Pehea ka 8 Layer Rigid Flexible PCB me 3 + 2 + 3 Stackup Solutions e hoʻomaikaʻi ai i ka hana o IOT 5G Communication
Nā koi ʻenehana | |
ʻAno huahana | Papa Kaapuni Pa'i Pai 'o Rigid Flex |
Ka helu o ka papa | 8 Papahana |
Laina laula a laina laina | 0.075MM/0.075MM |
Mānoanoa papa | 2.0MM+-10% |
Hoʻopaʻa Paʻa | 3+2+3 |
Aperture liʻiliʻi | 0.1MM |
Mānoanoa Puka keleawe | 12-15um |
Lapaʻau ʻili | ENIG 2-3uin |
Warpage | ≦0.5% |
Hoʻomanawanui pololei | ±0.1MM |
Hoao hana | AOI/ʻehā-uea/hoomau/kopa keleawe |
ʻOihana Hoʻohana | ʻOihana Pūnaewele o nā mea (IOT). |
Mea hoohana | Kūkākūkā 5G 64G |
8 Layers Rigid Flex PCB papa
5G kamaʻilio ma ka ʻoihana IOT
Ke ʻimi nei ʻoe i nā hopena hilinaʻi a kiʻekiʻe loa no kāu 8-layer rigid flex circuit board e pono ai i ka ʻoihana pūnaewele o nā mea (IOT)?ʻO kā mākou mau ʻāpana ʻokoʻa paʻa paʻa i kāu koho maikaʻi loa, i hoʻolālā kūikawā ʻia no ka IOT 5G Communication.
Me 16 mau makahiki o ka ʻoihana ʻoihana, haʻaheo ʻo Capel i ka hoʻolauna ʻana i kā mākou mea hou i ka ʻenehana papa kaapuni paʻi - he 8-layer rigid flex PCB me kahi 3+2+3 stacking solution.Hoʻolālā ʻia kēia huahana ʻokiʻoki e hoʻomaikaʻi nui i ka hana o nā mea hana ma ka Internet of Things (IoT) a me nā ʻoihana kamaʻilio 5G.Ma ka hoʻohui ʻana i nā hiʻohiʻona kiʻekiʻe e like me ka 3+2+3 layer stacking, pololei ka laulā laina a me ka spacing, a me ka ENIG surface treatment, hāʻawi kā mākou PCBs rigid-flex i ka hilinaʻi ʻole a me ka hana no nā noi koi loa.
Hoʻolālā kūikawā ʻia ka 8-layer rigid-flex PCB me 3+2+3 stacking solution e hoʻokō i nā koi koʻikoʻi o ka ʻoihana kamaʻilio IoT a me 5G.ʻO ka mānoanoa o ka papa PCB he 2.0mm a ʻo ka haʻahaʻa haʻahaʻa he 0.1mm, hiki ke kākoʻo i nā noi kiʻekiʻe a me ka wikiwiki.Hāʻawi ka 3+2+3 layer stacking i ka hoʻomaikaʻi ʻana i ka pono o ka hōʻailona a me ka mana impedance, e hōʻoia ana i ka hana maikaʻi loa no nā mea kamaʻilio e hana ana ma nā wikiwiki 5G.
ʻO kekahi o nā hiʻohiʻona koʻikoʻi o kā mākou PCBs rigid-flex ka laulā laina pololei a me ka spacing o 0.075mm, e ʻae ana i ka hoʻouna ʻana i ka hōʻailona kūpono a me ka hōʻemi ʻana i ka nalowale o ka hōʻailona.Eia kekahi, ʻo ka ENIG surface treatment me ka mānoanoa o 2-3uin e hōʻoia i ka maikaʻi loa o ka solderability a me ka corrosion, e hana i kā mākou PCB i kūpono no ka hoʻohana ʻana i nā wahi hana paʻakikī.
I mea e hōʻoia ai i ka hilinaʻi a me ka maikaʻi o nā papa rigid-flex, hana mākou i ka hoʻāʻo hana koʻikoʻi, me ka AOI, ka hoʻāʻo ʻehā-wire, ka hoʻāʻo hoʻomau a me ka hoʻāʻo ʻana i ka pepa keleawe.ʻO kēia kaʻina hoʻāʻo piha e hōʻoia i kēlā me kēia PCB i nā kūlana kiʻekiʻe o ka hana a me ka lōʻihi, e hāʻawi ana i kā mākou mea kūʻai aku i ka maluhia o ka noʻonoʻo a me ka hilinaʻi i kā lākou noi.
Hoʻonohonoho ʻia ka 8-layer rigid-flex PCB me 3+2+3 stacking solution no ka hoʻokō ʻana i nā pono loli o nā ʻoihana kamaʻilio IoT a me 5G.ʻO nā mea akamai paha, nā ʻōnaehana kelepona ʻole a i ʻole nā mea hoʻoili ʻikepili kiʻekiʻe, hāʻawi kā mākou PCB i ka hana a me ka hilinaʻi e pono ai e hoʻokau i nā mea hou i kēia mau kahua ikaika.Me ka hoʻokō ʻana o Capel i ka maikaʻi a me ka hana hou, kūpono kā mākou PCB paʻa i ka mana o ka hanauna hou o nā mea pili a me nā ʻenehana kamaʻilio.
ʻO nā mea āpau, ʻo Capel's 8-layer rigid-flex 3+2+3 stacking solution e hōʻike ana i kahi lele i ka ʻenehana PCB, e hāʻawi ana i ka hana like ʻole a me ka hilinaʻi no ka ʻoihana kamaʻilio IoT a me 5G.Me nā hiʻohiʻona kiʻekiʻe, nā kaʻina hoʻāʻo koʻikoʻi a me nā makahiki o ka ʻike, haʻaheo mākou e hāʻawi i kā mākou mea kūʻai aku i nā huahana i kūpono i nā kūlana kiʻekiʻe o ka maikaʻi a me ka hana.Ke hoʻomau nei ka ulu ʻana o ka ʻoihana, noho mau ʻo Capel i ke poʻo o ka hana hou, ke alakaʻi nei i ka holomua a hiki i nā ʻenehana holomua ke hoʻohui pono ʻia i loko o ka lole o kā mākou honua pili.
No ke aha e koho ai i kā mākou CAPEL
Shenzhen Capel Technology Co., Ltd. ua loea i ka hana ʻana okiʻekiʻe kiʻekiʻe, kiʻekiʻe-pololei hikiwawe papa kaapuni mai 2009.
Aia iā mākou 15 makahiki o ka 'oihanaa me ka ʻenehanaʻikea he kanaka makua, maikaʻi, a holomuahiki ke hana.
Hiki iā mākou ke hāʻawi i hoʻopilikino1-30 papa kaapuni hikiwawe,2-32 papa ʻoʻoleʻa PCBs, a1-60 mau papa PCB paakiki i nā mea kūʻai ma kaKaʻa kaʻaʻOihana.
Kākoʻo Kuʻuna1-30 Layer FPC PCB hikiwawe,2-32 Papa Kaapuni Oolea-Flex,1-60 Layer ʻoʻoleʻa PCB,Nā Papa HDI Pono Kiʻekiʻe,ʻO ka hoʻololi wikiwiki PCB Prototyping hilinaʻi,Huli wikiwiki SMT PCB Hui
Na Lapaau Lapaau,IOT, TUT, UAV, mokulele, Kaʻa kaʻa, Ke kelepona, Mea Hoʻohana Electronics, Koa, Aerospace, Ka Mana Hana, Naʻauao hana,EV, etc.
Māhele | Hiki i ke kaʻina hana | Māhele | Hiki i ke kaʻina hana |
ʻAno hana | FPC papa hoʻokahi / FPC papalua Nā ʻāpana FPC / Aluminum PCB ʻO ka PCB paʻa-Flex | Helu Lapa | 1-30 papaFPC PCB hikiwawe 2-32 papaPaʻa-FlexPCB1-60 papaPCB paakikiHDINā papa |
Nui Hana Hana | Hoʻokahi papa FPC 4000mm Nā papa ʻelua FPC 1200mm ʻO FPC 750mm Paʻa-Flex PCB 750mm | Laena hoʻopololeimānoanoa | 27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um |
Mānoanoa Papa | FPC 0.06mm - 0.4mm Paʻa-Flex PCB 0.25 - 6.0mm | Ka hoomanawanui o PTHNui | ±0.075mm |
Hoʻopau ʻili | Gula Kaiapuni/Kaiaulu Kālā Kālā/Gula/Pa'i Kina/OSP | Mea ʻoʻoleʻa | FR4 / PI / PET / SUS / PSA/Alu |
Ka nui o ka Puka Semicircle | Min 0.4mm | Min Line Space/ākea | 0.045mm/0.045mm |
Hoʻomanawanui mānoanoa | ±0.03mm | Ka hoʻopalekana | 50Ω-120Ω |
Mānoanoa Copper Foil | 9um / 12um / 18um / 35um / 70um / 100um | Ka hoʻopalekanaKāohi ʻiaHoʻomanawanui | ± 10% |
Ka hoʻomanawanui o NPTHNui | ±0.05mm | ʻO ka Min Flush Laulā | 0.80mm |
Min Via Hole | 0.1mm | HoʻokōKūlana | GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III |
Gula Kaiapuni | AU 0.025-0.075UM /NI1-4UM | Electro nickel gula | AU 0.025-25.4UM / NI 1-25.4UM |
Nā palapala hōʻoia | UL a me ROHS ISO 14001:2015 ISO 9001:2015 IATF16949:2016 | Palapala Sila | palapala hoʻohālike mea hoʻopaneʻe |
8 papa HDI nā PCB hikiwawe no ka Lapaʻau 10 papa ʻo Rigid-Flex Circuit Boards no Aerospace
4 papa Flex PCB Kaapuni no ka Mana Hana 16 papa ʻo Rigid Flexible PCBs no ka Automotive
Loaʻa iā mākou nā mea hana a me nā ʻenehana hou loa, me nā mīkini photolithography kiʻekiʻe, nā mīkini etching, nā lako hui,etc.ʻO kēia mau mea
hōʻoia nā mea hana i ka pololei, kūpono, a me ka paʻa o ke kaʻina hana, e hāʻawi i nā mea kūʻai aku me nā huahana kiʻekiʻe.huahana maikaʻi.Nā huahana papa kaapuni hikiwawe kiʻekiʻe.
Hoʻokumu mua kā mākou hui i ka mana maikaʻi a hoʻokō i kahi ʻano o nā ana mana koʻikoʻi koʻikoʻi i loko o ke kaʻina hana holoʻokoʻa.ʻO kēlā me kēia pae mai ke koho ʻana a me ke kūʻai ʻana
ʻO nā mea maka i ka hana ʻana a me ka hoʻopaʻa ʻana ua nānā ʻia a hoʻāʻo ʻia e hōʻoia i kēlā me kēia huahana papa kaapuni maʻalahi e kū i nā kūlana kiʻekiʻe.
Loaʻa iā mākou kahi ʻōnaehana hoʻokele hana kūpono e hoʻomaikaʻi i ke kaʻina hana, hoʻomaikaʻi i ka hana hana a hoʻemi i nā kumukūʻai.Me ka ʻike hana waiwai, hiki iā mākou ke pane koke i nā pono o ka mea kūʻai aku a hōʻoia i ka hāʻawi ʻana i ka manawa.
ʻO ka lawelawe ma hope o ke kūʻai aku:
He mea kūʻai aku mākou a hāʻawi i ka lawelawe ma hope o ke kūʻai aku.Ke hoʻoponopono nei i nā pilikia i ka wā o ka hoʻohana ʻana i ka huahana a i ʻole ka hāʻawi ʻana i ke kākoʻo ʻenehana a me nā lawelawe hoʻoponopono, hiki iā mākou ke pane i ka manawa kūpono a hāʻawi i nā hoʻonā.Ma ka hoʻohana ʻana i kēia mau ʻōlelo, hiki iā ʻoe ke hōʻike maikaʻi i ka ikaika a me nā pono o ka ʻoihana ma ke kaʻina hana hana papa kaapuni maʻalahi, a laila e loaʻa ai ka hilinaʻi a me ka ʻike o nā mea kūʻai aku.
Hiki iā mākou ke hāʻawi aku i nā mea kūʻai aku me ke kūlana kiʻekiʻeprototyping wikiwiki, hikiwawe hilinaʻinuipa? iecaianoaaiiuo, ahoʻouna wikiwikito kōkua i kā lākou mau papahana e komo koke i ka mākeke a loaʻa nā pono hoʻokūkū.
ʻO ka hoʻokele kaulahao ikaika:
Ua hoʻokumu mākou i nā pilina pili lōʻihi me ka nui o nā mea hoʻolako kiʻekiʻe e hōʻoia i ka loaʻa ʻana o ka manawa i nā mea waiwai kiʻekiʻe.Ma ka manawa like, loaʻa iā mākou kahi pūʻulu hoʻokele waiwai hoʻolako e hiki ke hoʻomalu piha i ke kūlana hoʻolako o nā mea maka, e hōʻoia i ka loaʻa ʻana o nā mea i ka manawa, a kākoʻo i ka hana wikiwiki a me ka lawe ʻana.
Hoʻolālā hana maʻalahi:
Hoʻokomo mākou i kahi ʻōnaehana hoʻolālā hana kiʻekiʻe e hiki ke hoʻoponopono wikiwiki a hoʻonohonoho e like me nā pono o ka mea kūʻai.ʻO ka hana prototype a i ʻole ka hana nui, hiki iā mākou ke hoʻokaʻawale i nā kumuwaiwai e hoʻopau i ka hana i ka manawa pōkole a hōʻoia i ka lawe ʻana i ka manawa.
Kaʻina hana kūpono:
Loaʻa iā mākou kahi kaʻina hana hana kūpono a hoʻolālā pono a mālama i ke kaʻina holoʻokoʻa mai ka loaʻa ʻana o ke kauoha i ka hoʻouna ʻana i nā huahana.Ma ka hoʻonui ʻana i ke kaʻina hana, ka hoʻomaikaʻi ʻana i ka pono hana, a me ka hoʻokō ʻana i nā ʻano hoʻomalu maikaʻi, hiki iā mākou ke hana wikiwiki a hāʻawi i nā huahana e hōʻoia i ka hoʻomaka ʻana o nā papahana o kā mākou mea kūʻai.
Pane wikiwiki:
Hoʻopili nui mākou i nā pono o ka mea kūʻai aku a hiki iā mākou ke pane wikiwiki a hoʻoponopono i ka hana a me ka hoʻonohonoho ʻana e like me ia.Inā he kauoha wikiwiki a i ʻole kahi kūlana i manaʻo ʻole ʻia, hiki iā mākou ke hoʻoholo wikiwiki a hana i nā hana kūpono e hōʻoia i ka lawe ʻana i ka manawa.
ʻO ka hoʻokele logistic hilinaʻi:
Hana pū mākou me kekahi mau hui loea loea e hōʻoia i ka hāʻawi ʻia ʻana o nā waiwai i nā mea kūʻai aku me ka palekana a me ka manawa kūpono.Loaʻa iā mākou kahi kaʻina hoʻokele logistic piha a me ka ʻōnaehana warehousing e hiki ke nānā pono i ke kūlana o ka halihali a hōʻoia i ka lawe ʻana i ka manawa.
Ka manawa hoʻouna: Mar-23-2024
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