Pehea ʻo 8 Layer Rigid Flexible PCB me 3 + 2 + 3 Stackup Solutions e hoʻomaikaʻi i ka hana o IOT 5G Communication

Nā koi ʻenehana
ʻAno huahana	Papa Kaapuni Pa'i Pai 'o Rigid Flex
Ka helu o ka papa	8 Papahana
Laina laula a laina laina	0.075MM/0.075MM
Mānoanoa papa	2.0MM+-10%
Hoʻopaʻa Paʻa	3+2+3
Aperture liʻiliʻi	0.1MM
Mānoanoa Puka keleawe	12-15um
Lapaʻau ʻili	ENIG 2-3uin
Warpage	≦0.5%
Hoʻomanawanui pololei	±0.1MM
Hoao hana	AOI/ʻehā-uea/hoomau/kopa keleawe
ʻOihana Hoʻohana	ʻOihana Pūnaewele o nā mea (IOT).
Mea hoohana	Kūkākūkā 5G 64G

8 Layer Rigid Flex PCB Me 3+2+3 Stackup Solutions No IOT 5G Communication

8 Layers Rigid Flex PCB papa

5G kamaʻilio ma ka ʻoihana IOT

Ke ʻimi nei ʻoe i nā hopena hilinaʻi a kiʻekiʻe loa no kāu 8-layer rigid flex circuit board e pono ai i ka ʻoihana pūnaewele o nā mea (IOT)? ʻO kā mākou mau ʻāpana paʻa paʻa paʻa i kāu koho maikaʻi loa, i hoʻolālā kūikawā ʻia no ka IOT 5G Communication.

Me 16 mau makahiki o ka ʻoihana ʻoihana, haʻaheo ʻo Capel i ka hoʻolauna ʻana i kā mākou mea hou i ka ʻenehana papa kaapuni paʻi - he 8-layer rigid flex PCB me kahi 3+2+3 stacking solution. Hoʻolālā ʻia kēia huahana ʻokiʻoki e hoʻomaikaʻi nui i ka hana o nā mea hana ma ka Internet of Things (IoT) a me nā ʻoihana kamaʻilio 5G. Ma ka hoʻohui ʻana i nā hiʻohiʻona kiʻekiʻe e like me ka 3+2+3 layer stacking, pololei ka laulā laina a me ka spacing, a me ka ENIG surface treatment, hāʻawi kā mākou PCBs rigid-flex i ka hilinaʻi ʻole a me ka hana no nā noi koi loa.

Hoʻolālā kūikawā ʻia ka 8-layer rigid-flex PCB me 3+2+3 stacking solution e hoʻokō i nā koi koʻikoʻi o ka ʻoihana kamaʻilio IoT a me 5G. ʻO ka mānoanoa o ka papa PCB he 2.0mm a ʻo ka haʻahaʻa haʻahaʻa he 0.1mm, hiki ke kākoʻo i nā noi kiʻekiʻe a me ka wikiwiki. Hāʻawi ka 3+2+3 layer stacking i ka hoʻomaikaʻi ʻana i ka pono o ka hōʻailona a me ka mana impedance, e hōʻoia ana i ka hana maikaʻi loa no nā mea kamaʻilio e hana ana ma nā wikiwiki 5G.

ʻO kekahi o nā hiʻohiʻona koʻikoʻi o kā mākou PCBs rigid-flex ka laulā laina pololei a me ka spacing o 0.075mm, e ʻae ana i ka hoʻouna ʻana i ka hōʻailona kūpono a me ka hōʻemi ʻana i ka nalowale o ka hōʻailona. Eia kekahi, ʻo ka ENIG surface treatment me ka mānoanoa o 2-3uin e hōʻoia i ka maikaʻi loa o ka solderability a me ka corrosion, e hana i kā mākou PCB i kūpono no ka hoʻohana ʻana i nā wahi hana paʻakikī.

I mea e hōʻoia ai i ka hilinaʻi a me ka maikaʻi o nā papa rigid-flex, hana mākou i ka hoʻāʻo hana koʻikoʻi, me ka AOI, ka hoʻāʻo ʻehā-wire, ka hoʻāʻo hoʻomau a me ka hoʻāʻo ʻana i ka pepa keleawe. ʻO kēia kaʻina hoʻāʻo piha e hōʻoia i kēlā me kēia PCB i nā kūlana kiʻekiʻe o ka hana a me ka lōʻihi, e hāʻawi ana i kā mākou mea kūʻai aku i ka maluhia o ka noʻonoʻo a me ka hilinaʻi i kā lākou noi.

Hoʻonohonoho ʻia ka 8-layer rigid-flex PCB me 3+2+3 stacking solution no ka hoʻokō ʻana i nā pono loli o nā ʻoihana kamaʻilio IoT a me 5G. ʻO nā mea akamai paha, nā ʻōnaehana kelepona ʻole a i ʻole nā mea hoʻoili ʻikepili kiʻekiʻe, hāʻawi kā mākou PCB i ka hana a me ka hilinaʻi e pono ai e hoʻokau i nā mea hou i kēia mau kahua ikaika. Me ka hoʻokō ʻana o Capel i ka maikaʻi a me ka hana hou, kūpono kā mākou PCB paʻa i ka mana o ka hanauna hou o nā mea pili a me nā ʻenehana kamaʻilio.

ʻO nā mea āpau, ʻo Capel's 8-layer rigid-flex 3+2+3 stacking solution e hōʻike ana i kahi lele i ka ʻenehana PCB, e hāʻawi ana i ka hana like ʻole a me ka hilinaʻi no ka ʻoihana kamaʻilio IoT a me 5G. Me nā hiʻohiʻona kiʻekiʻe, nā kaʻina hoʻāʻo koʻikoʻi a me nā makahiki o ka ʻike, haʻaheo mākou e hāʻawi i kā mākou mea kūʻai aku i nā huahana i kūpono i nā kūlana kiʻekiʻe o ka maikaʻi a me ka hana. Ke hoʻomau nei ka ulu ʻana o ka ʻoihana, noho mau ʻo Capel i ke poʻo o ka hana hou, ke alakaʻi nei i ka holomua a hiki i nā ʻenehana holomua ke hoʻohui pono ʻia i loko o ka lole o kā mākou honua pili.

No ke aha e koho ai i kā mākou CAPEL

Shenzhen Capel Technology Co., Ltd. ua loea i ka hana ʻana okiʻekiʻe kiʻekiʻe, kiʻekiʻe-pololei hikiwawe papa kaapuni mai 2009.

Aia iā mākou 15 makahiki o ka 'oihanaa me ka ʻenehanaʻikea he kanaka makua, maikaʻi, a holomuahiki ke hana.

Hiki iā mākou ke hāʻawi i hoʻopilikino1-30 papa kaapuni hikiwawe,2-32 papa ʻoʻoleʻa PCBs, a1-60 mau papa PCB paakiki i nā mea kūʻai ma kaKaʻa kaʻaʻOihana.

Ka lawelawe a Capel:

Kākoʻo Kuʻuna1-30 Layer FPC PCB hikiwawe,2-32 Papa Kaapuni Oolea-Flex,1-60 Layer ʻoʻoleʻa PCB,Nā Papa HDI Pono Kiʻekiʻe,ʻO ka hoʻololi wikiwiki ʻana i ka PCB Prototyping,Huli wikiwiki SMT PCB Hui

ʻOihana mākou lawelawe:

Na Lapaau Lapaau,IOT, TUT, UAV, mokulele, Kaʻa kaʻa, Ke kelepona, Mea Hoʻohana Electronics, Koa, Aerospace, Ka Mana Hana, Naʻauao hana,EV, etc.

Māhele	Hiki i ke kaʻina hana	Māhele	Hiki i ke kaʻina hana
ʻAno hana	FPC papa hoʻokahi / FPC papalua Nā ʻāpana FPC / Aluminum PCB ʻO ka PCB paʻa-Flex	Helu Lapa	1-30 papaFPC PCB hikiwawe 2-32 papaPaʻa-FlexPCB1-60 papaPCB paakikiHDINā papa
Nui Hana Hana	Hoʻokahi papa FPC 4000mm Nā papa ʻelua FPC 1200mm ʻO FPC 750mm Paʻa-Flex PCB 750mm	Laena hoʻopololeimānoanoa	27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um
Mānoanoa Papa	FPC 0.06mm - 0.4mm Paʻa-Flex PCB 0.25 - 6.0mm	Ka hoomanawanui o PTHNui	±0.075mm
Hoʻopau ʻili	Gula Kaiapuni/Kaiaulu Kālā Kālā/Gula/Pa'i Kina/OSP	Mea ʻoʻoleʻa	FR4 / PI / PET / SUS / PSA/Alu
Ka nui o ka Puka Semicircle	Min 0.4mm	Min Line Space/ākea	0.045mm/0.045mm
Hoʻomanawanui mānoanoa	±0.03mm	Ka hoʻopalekana	50Ω-120Ω
Mānoanoa Copper Foil	9um / 12um / 18um / 35um / 70um / 100um	Ka hoʻopalekanaKāohi ʻiaHoʻomanawanui	±10%
Ka hoʻomanawanui o NPTHNui	±0.05mm	ʻO ka Min Flush Laulā	0.80mm
Min Via Hole	0.1mm	HoʻokōKūlana	GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III
Gula Kaiapuni	AU 0.025-0.075UM /NI1-4UM	Electro nickel gula	AU 0.025-25.4UM / NI 1-25.4UM
Nā palapala hōʻoia	UL a me ROHS ISO 14001:2015 ISO 9001:2015 IATF16949:2016	Palapala Sila	palapala hoʻohālike mea hoʻopaneʻe

8 papa HDI nā PCB hikiwawe no ka Lapaʻau 10 papa ʻo Rigid-Flex Circuit Boards no Aerospace

4 papa Flex PCB Kaapuni no ka Mana Hana 16 papa ʻo Rigid Flexible PCBs no ka Automotive

Nā lako hana kiʻekiʻe:

Loaʻa iā mākou nā mea hana a me nā ʻenehana hou loa, me nā mīkini photolithography kiʻekiʻe, nā mīkini etching, nā lako hui,etc.ʻO kēia mau mea

hōʻoia nā mea hana i ka pololei, kūpono, a me ka paʻa o ke kaʻina hana, e hāʻawi i nā mea kūʻai aku me nā huahana kiʻekiʻe. huahana maikaʻi. Nā huahana papa kaapuni hikiwawe kiʻekiʻe.

Ka mana maikaʻi koʻikoʻi:

Hoʻokumu mua kā mākou hui i ka mana maikaʻi a hoʻokō i kahi ʻano o nā ana mana koʻikoʻi koʻikoʻi i loko o ke kaʻina hana holoʻokoʻa. ʻO kēlā me kēia pae mai ke koho ʻana a me ke kūʻai ʻana

ʻO nā mea maka i ka hana ʻana a me ka hoʻopaʻa ʻana ua nānā ʻia a hoʻāʻo ʻia e hōʻoia i kēlā me kēia huahana papa kaapuni maʻalahi e kū i nā kūlana kiʻekiʻe.

Hoʻoponopono hana maikaʻi:

Loaʻa iā mākou kahi ʻōnaehana hoʻokele hana kūpono e hoʻomaikaʻi i ke kaʻina hana, hoʻomaikaʻi i ka hana hana a hoʻemi i nā kumukūʻai. Me ka ʻike hana waiwai, hiki iā mākou ke pane koke i nā pono o ka mea kūʻai aku a hōʻoia i ka hāʻawi ʻana i ka manawa.

ʻO ka lawelawe ma hope o ke kūʻai aku:

He mea kūʻai aku mākou a hāʻawi i ka lawelawe ma hope o ke kūʻai aku. Ke hoʻoponopono nei i nā pilikia i ka wā o ka hoʻohana ʻana i ka huahana a i ʻole ka hāʻawi ʻana i ke kākoʻo ʻenehana a me nā lawelawe hoʻoponopono, hiki iā mākou ke pane i ka manawa kūpono a hāʻawi i nā hoʻonā. Ma ka hoʻohana ʻana i kēia mau ʻōlelo, hiki iā ʻoe ke hōʻike maikaʻi i ka ikaika a me nā pono o ka ʻoihana ma ke kaʻina hana hana papa kaapuni maʻalahi, a laila e loaʻa ai ka hilinaʻi a me ka ʻike o nā mea kūʻai aku.

Hiki iā mākou ke hāʻawi aku i nā mea kūʻai aku me ke kūlana kiʻekiʻeprototyping wikiwiki, hikiwawe hilinaʻihana nui, ahoʻouna wikiwikito kōkua i kā lākou mau papahana e komo koke i ka mākeke a loaʻa nā pono hoʻokūkū.

ʻO ka hoʻokele kaulahao ikaika:

Ua hoʻokumu mākou i nā pilina pili lōʻihi me ka nui o nā mea hoʻolako kiʻekiʻe e hōʻoia i ka loaʻa ʻana o ka manawa i nā mea waiwai kiʻekiʻe. Ma ka manawa like, loaʻa iā mākou kahi pūʻulu hoʻokele waiwai hoʻolako e hiki ke hoʻomalu piha i ke kūlana hoʻolako o nā mea maka, e hōʻoia i ka loaʻa ʻana o nā mea i ka manawa, a kākoʻo i ka hana wikiwiki a me ka lawe ʻana.

Hoʻolālā hana maʻalahi:

Hoʻokomo mākou i kahi ʻōnaehana hoʻolālā hana kiʻekiʻe e hiki ke hoʻoponopono wikiwiki a hoʻonohonoho e like me nā pono o ka mea kūʻai. ʻO ka hana prototype a i ʻole ka hana nui, hiki iā mākou ke hoʻokaʻawale i nā kumuwaiwai e hoʻopau i ka hana i ka manawa pōkole a hōʻoia i ka lawe ʻana i ka manawa.

Kaʻina hana kūpono:

Loaʻa iā mākou kahi kaʻina hana hana kūpono a hoʻolālā pono a mālama i ke kaʻina holoʻokoʻa mai ka loaʻa ʻana o ke kauoha i ka hoʻouna ʻana i nā huahana. Ma ka hoʻonui ʻana i ke kaʻina hana, ka hoʻomaikaʻi ʻana i ka pono hana, a me ka hoʻokō ʻana i nā ʻano kaohi maikaʻi, hiki iā mākou ke hana wikiwiki a hāʻawi i nā huahana e hōʻoia i ka hoʻomaka ʻana o nā papahana o kā mākou mea kūʻai.

Pane wikiwiki:

Hoʻopili nui mākou i nā pono o ka mea kūʻai aku a hiki iā mākou ke pane wikiwiki a hoʻoponopono i ka hana a me ka hoʻonohonoho ʻana e like me ia. Inā he kauoha wikiwiki a i ʻole kahi kūlana i manaʻo ʻole ʻia, hiki iā mākou ke hoʻoholo wikiwiki a hana i nā hana kūpono e hōʻoia i ka lawe ʻana i ka manawa.

ʻO ka hoʻokele logistic hilinaʻi:

Hana pū mākou me kekahi mau hui loea loea e hōʻoia i ka hāʻawi ʻia ʻana o nā waiwai i nā mea kūʻai aku me ka palekana a me ka manawa kūpono. Loaʻa iā mākou kahi kaʻina hoʻokele logistic piha a me ka ʻōnaehana warehousing e hiki ke nānā pono i ke kūlana o ka halihali a hōʻoia i ka lawe ʻana i ka manawa.