Ke hoʻolauna nei i kā mākou papa kaapuni 8-layer rigid-flex hou loa, ka hopena hope loa no kāu pono kamaʻilio āpau. Hoʻolālā ʻia kēia mau papa no nā kamaʻilio 5G kiʻekiʻe, e hāʻawi ana i ka hana like ʻole a me ka hilinaʻi.

ʻO ka laulā laina a me ka spacing laina o kā mākou papa he 0.075MM / 0.075MM, e hōʻoiaʻiʻo ana i ka hoʻouna ʻana i ka hōʻailona maikaʻi loa a hiki ke kamaʻilio maʻemaʻe a hiki i nā mamao lōʻihi. ʻO 2.0MM ka mānoanoa o ka pā, ʻo ka hoʻomanawanui he ± 10%, a paʻa a paʻa ka hale.

Hoʻonui ka 3+2+3 layer stacking i ka maʻalahi a me ka hana o ka papa, e maʻalahi ai ka hoʻohui ʻana i nā mea kamaʻilio like ʻole. Hoʻohui ʻia, ʻae ka haʻahaʻa haʻahaʻa o 0.1MM no ka hoʻokele hōʻailona pololei.

ʻO ka mānoanoa o ka puka keleawe o kā mākou 8-layer rigid-flex circuit board he 12-15um, e hāʻawi ana i ka conductivity maikaʻi loa a hōʻoia i ka hoʻouna ʻana i nā hōʻailona ʻikepili. Hāʻawi ka ENIG 2-3uin i ka mālama ʻana i ka pale oxidation maikaʻi loa a hoʻonui i ke ola o ka papa.

Loaʻa i ka papa ka nui o ka warpage haʻahaʻa ma lalo o 0.5%, e hōʻike ana i kona kūpaʻa a me ke kūpaʻa ʻana i nā ikaika o waho. Me ka pololei o ka hoʻomanawanui ʻana o ± 0.1MM, hiki iā ʻoe ke hilinaʻi e hoʻokō kā mākou papa i nā kūlana kiʻekiʻe loa a hana mau.