Hoʻomaka: ʻO nā pilikia ʻenehana i nā ʻenehana uila a meNā Hana Hou a Capel

Ke holo nei ke kaʻa kaʻa kaʻawale i ka L5 a me nā ʻōnaehana hoʻokele pākaukau (BMS) kaʻa uila (EV) e koi i ka nui o ka ikehu a me ka palekana, paʻakikī nā ʻenehana PCB kuʻuna e hoʻoponopono i nā pilikia koʻikoʻi:

• ʻO nā pilikia holo wela: ʻOi aku ka nui o nā chipsets ECU ma mua o 80W, me nā mahana kūloko a hiki i 150°C
• Nā palena hoʻohui 3D: Pono ka BMS i 256+ mau kaha hōʻailona i loko o 0.6mm ka mānoanoa o ka papa
• Kuʻi haʻalulu: Pono nā mea ʻike kūʻokoʻa e kū i nā haʻalulu mechanical 20G
• Nā Koi Hoʻoemi: Pono nā mea hoʻoponopono LiDAR i ka 0.03mm ākea ākea a me 32-layer stacking

ʻO Capel Technology, e hoʻohana ana i nā makahiki 15 o R&D, hoʻolauna i kahi hopena hoʻololi e hui pū aikiʻekiʻe thermal conductivity PCBs(2.0W/mK),nā PCB pale wela kiʻekiʻe(-55°C~260°C), a32-papaUa kanu ʻia/makapō ʻo HDI ma o ka ʻenehana(0.075mm microvias).

Mahele 1: Hoʻololi Hoʻokele Thermal no nā ECU hoʻokele kaʻawale

1.1 ECU mau pilikia wela

• ʻO Nvidia Orin chipset puʻupuʻu wela wela: 120W/cm²
• ʻO nā substrate FR-4 maʻamau (0.3W/mK) ke kumu o 35% o ka wela o ka wela o ka hui ʻana.
• ʻO 62% o nā hemahema ECU mai ka luhi solder i hoʻoulu ʻia i ka wela

1.2 ʻO ka ʻenehana hoʻoponopono wela a Capel

Mea Hana Hou:

• Nano-alumina i hooikaikaia polyimide substrates (2.0±0.2W/mK thermal conductivity)
• 3D mau kia keleawe (400% hoʻonui i ka wela wela)

Kaʻina Hana:

• Laser Direct Structuring (LDS) no nā ala wela maikaʻi
• Hoʻopaʻa ʻia ʻo Hybrid: 0.15mm ke keleawe ʻoi loa ka lahilahi + 2oz mau ʻāpana keleawe kaumaha

Hoʻohālikelike Hana:

Mahele 2: BMS Wiring Revolution me 32-Layer HDI Technology

2.1 Nā Lae ʻEha ʻOihana ma ka Hoʻolālā BMS

• Pono nā paepae 800V i 256+ mau kaha kiaʻi uila uila
• ʻOi aku ka nui o nā hoʻolālā maʻamau i nā palena ākea e 200% me 15% impedance mismatch

2.2 ʻO nā mea hoʻonā hoʻopili kiʻekiʻe kiʻekiʻe o Capel

ʻEnekinia Stackup:

• 1+N+1 i kēlā me kēia ʻāpana HDI (32 papa ma 0.035mm mānoanoa)
• ± 5% ka mana impedance ʻokoʻa (10Gbps nā hōʻailona kiʻekiʻe-wikiwiki)

ʻenehana Microvia:

• 0.075mm laser-makapō vias (12:1 hiʻohiʻona lākiō)
• <5% ka helu ʻole ʻana o ka hoʻopaʻa ʻana (IPC-6012B Papa 3 kūpono)

Nā hualoaʻa hōʻailona:

Mahele 3: Kūleʻa Kūlohelohe Kūlohelohe - MIL-SPEC Nā Manaʻo i hōʻoia ʻia

3.1 Kiekie-Mahana Mea Hana Hana

• Ke aniani hoʻololi ʻana (Tg): 280°C (IPC-TM-650 2.4.24C)
• ʻO ke ana wela (Td): 385°C (5% poho kaumaha)
• Ke Ola Pu'iwahana: 1,000 mau pō'ai (-55°C↔260°C)

3.2 Nā ʻenehana Palekana Pono

• ʻO ka uhi polimer i hoʻopaʻa ʻia i ka plasma (1,000h ka pale ʻana i ka paʻakai paʻakai)
• 3D EMI pale pale (60dB attenuation @10GHz)

Mahele 4: Hoʻopaʻa Hana - Hui pū me Global Top 3 EV OEM

4.1 800V BMS Mana Mana

• Paʻa: Hoʻohui i ka AFE 512-channel ma 85 × 60mm ākea
• Hoʻoholo:
  1. 20-layer rigid-flex PCB (3mm radius piko)
  2. Pūnaehana ʻike wela i hoʻokomo ʻia (0.03mm laula ʻia)
  3. ʻO ka hoʻoheheʻe ʻana i ka metala-koko kūloko (0.15°C·cm²/W ke kūpaʻa wela)

4.2 L4 Mana Mana Kūʻokoʻa

• Nā hualoaʻa:
  • 40% hoemi mana (72W → 43W)
  • 66% hōʻemi nui vs. nā hoʻolālā maʻamau
  • ASIL-D hōʻoia palekana hana

Mahele 5: Nā palapala hōʻoia a me ka hōʻoia maikaʻi

ʻOi aku ka ʻōnaehana maikaʻi o Capel i nā kūlana kaʻa:

• MIL-SPEC palapala hōʻoia: Kūlike me GJB 9001C-2017
• Hoʻokō kaʻa: IATF 16949:2016 + AEC-Q200 hōʻoia
• Ho'āʻo Pono:
  • 1,000h HAST (130°C/85% RH)
  • 50G haʻalulu mīkini (MIL-STD-883H)

Ka hopena: Next-Gen PCB Technology Roadmap

ʻO Capel ka paionia:

• Nā ʻāpana passive i hoʻokomo ʻia (30% mālama wahi)
• Optoelectronic hybrid PCBs (0.2dB/cm poho @850nm)
• Nā ʻōnaehana DFM i alakaʻi ʻia e AI (15% ka hoʻomaikaʻi ʻana i ka hua)

E kelepona i kā mākou hui ʻenekiniai kēia lā e hoʻomohala pū i nā hoʻonā PCB maʻamau no kāu mea uila uila hou.