ʻO nā mea nui o kahi Multilayer FPC PCB

ʻO nā papa kaapuni paʻi maʻalahi multilayer (FPC PCBs) he ʻāpana koʻikoʻi i hoʻohana ʻia i nā ʻano mea uila like ʻole, mai nā smartphones a me nā papa i nā mea lapaʻau a me nā ʻōnaehana kaʻa. Hāʻawi kēia ʻenehana kiʻekiʻe i ka maʻalahi, ka lōʻihi a me ka hoʻouna ʻana i nā hōʻailona maikaʻi, no laila e ʻimi nui ʻia i ka honua kikohoʻe wikiwiki i kēia mau lā.Ma kēia pou moʻomanaʻo, e kūkākūkā mākou i nā mea nui e hana i kahi multilayer FPC PCB a me kā lākou mea nui i nā noi uila.

1. ʻO ka substrate maʻalahi:

ʻO ka substrate maʻalahi ke kumu o ka multilayer FPC PCB.Hāʻawi ia i ka maʻalahi kūpono a me ka pono mechanical e kū i ke kūlou ʻana, ka pelu a me ka wili me ka ʻole o ka hoʻokō ʻana i ka hana uila. ʻO ka maʻamau, hoʻohana ʻia nā mea polyimide a i ʻole polyester ma ke ʻano he substrate kumu ma muli o ko lākou kūpaʻa wela maikaʻi loa, insulation uila, a me ka hiki ke mālama i ka neʻe ikaika.

2. Papa alakaʻi:

ʻO nā ʻāpana conductive nā mea koʻikoʻi o kahi multilayer FPC PCB no ka mea e hoʻomaʻamaʻa lākou i ke kahe o nā hōʻailona uila i ke kaapuni.Hana ʻia kēia mau papa i ke keleawe, nona ka conductivity uila maikaʻi loa a me ke kūpaʻa corrosion. Hoʻopili ʻia ka pahu keleawe i ka substrate maʻalahi me ka hoʻohana ʻana i kahi adhesive, a hana ʻia kahi kaʻina hana etching e hana i ke ʻano kaapuni i makemake ʻia.

3. ʻĀpana hoʻokaʻawale:

Hoʻokomo ʻia nā ʻāpana insulating, ʻike ʻia hoʻi nā papa dielectric, ma waena o nā papa conductive e pale i nā pōkole uila a hāʻawi i kahi kaʻawale.Hana ʻia lākou i nā mea like ʻole e like me ka epoxy, polyimide a i ʻole solder mask, a loaʻa ka ikaika dielectric kiʻekiʻe a me ke kūpaʻa wela. He kuleana koʻikoʻi kēia mau papa i ka mālama ʻana i ka pololei o ka hōʻailona a me ka pale ʻana i ka crosstalk ma waena o nā ala conductive pili.

4. Palekana Solder:

ʻO Solder mask kahi papa pale i hoʻohana ʻia i nā papa conductive a insulating e pale ai i nā pōkole pōkole i ka wā e kūʻai aku ai a pale i nā ʻāpana keleawe mai nā mea kūlohelohe e like me ka lepo, ka wai, a me ka oxidation.He ʻōmaʻomaʻo maʻamau ka waihoʻoluʻu akā hiki ke hele mai i nā kala ʻē aʻe e like me ka ʻulaʻula, uliuli a ʻeleʻele paha.

5. Kaulana:

ʻO Coverlay, ʻike ʻia hoʻi ʻo ka uhi kiʻiʻoniʻoni a i ʻole ka uhi kiʻiʻoniʻoni, he papa pale i hoʻopili ʻia i ka ʻili o waho o ka multi-layer FPC PCB.Hāʻawi ia i ka insulation hou, ka pale mechanical a me ke kū'ē i ka makū a me nā mea haumia ʻē aʻe. Loaʻa i nā uhi uhi maʻamau nā puka no ka waiho ʻana i nā ʻāpana a hiki ke komo maʻalahi i nā pads.

6. Ka uhi keleawe:

ʻO ka pāpale keleawe ka hana o ka electroplating i kahi ʻāpana keleawe ma luna o kahi papa conductive.Kōkua kēia kaʻina hana i ka hoʻomaikaʻi ʻana i ka conductivity uila, ka haʻahaʻa haʻahaʻa, a me ka hoʻomaikaʻi ʻana i ka paʻa piha o ka multilayer FPC PCB. Hoʻomaʻamaʻa pū ka hoʻopaʻa ʻana i ke keleawe i nā meheu kani maikaʻi no nā kaapuni kiʻekiʻe.

7. Vias:

ʻO ka via he puka liʻiliʻi i wili ʻia ma nā ʻāpana conductive o kahi FPC PCB multi-layer, e hoʻopili ana i hoʻokahi a ʻoi aku paha nā papa.Hāʻawi lākou i ka pilina kūpaʻa a hiki i ka hoʻokele hōʻailona ma waena o nā papa like ʻole o ke kaapuni. Hoʻopiha pinepine ʻia ʻo Vias i ke keleawe a i ʻole conductive paste e hōʻoia i kahi pilina uila hilinaʻi.

8. Nā papa helu:

ʻO nā pad component nā wahi ma kahi multilayer FPC PCB i koho ʻia no ka hoʻopili ʻana i nā mea uila e like me nā resistors, capacitors, integrated circuit, a me nā mea hoʻohui.Hana ʻia kēia mau pads i ke keleawe a hoʻopili ʻia i nā traces conductive i lalo me ka hoʻohana ʻana i ka solder a i ʻole conductive adhesive.

Ma ka hōʻuluʻulu manaʻo:

ʻO ka papa kaapuni paʻi paʻi paʻi multilayer (FPC PCB) he hale paʻakikī i haku ʻia me nā ʻāpana kumu.ʻO nā substrate maʻalahi, nā papa conductive, nā ʻāpana insulating, nā masks solder, overlays, nā uhi keleawe, nā vias a me nā ʻāpana pad e hana pū me ka hoʻolako ʻana i ka pilina uila e pono ai, hiki ke loli a me ka lōʻihi e koi ʻia e nā mea uila hou. ʻO ka hoʻomaopopo ʻana i kēia mau mea nui e kōkua i ka hoʻolālā ʻana a me ka hana ʻana i nā PCB FPC multilayer kiʻekiʻe e kūpono i nā koi koʻikoʻi o nā ʻoihana like ʻole.