Hana Ahahui CAPEL SMT
Nā FPC & PCB a me nā PCB Pa'a-Flex
Nā lawelawe hui PCB wikiwiki
√ 1-2 mau lā huli wikiwiki pcb hui prototype
√ 2-5 mau lā ma ka pūnaewele mai nā mea hoʻolako pono
√ Pane wikiwiki no ke kākoʻo ʻenehana a me ka ʻōlelo aʻo
√ Ka nānā ʻana o BOM e hōʻoia i ka kūlike o ka ʻāpana a me ka pololei o ka ʻikepili
AHAOLELO SMT
Huli Kiʻekiʻe Prototype
Hana Nui
Ma hope o ke kūʻai aku 24 online
Kaʻina Hana Hana CAPEL
Hoʻomākaukau Mea → Solder Paste Printing→ SPI→ IPQC→ Surface Mount Technology→ Reflow Soldering
↓
Palekana a me ka Packaging ← Ma hope o ka wili ʻana ← Wave Soldering ← X-ray ←AOI ← ʻO ka hoʻāʻo mua Artide
CAPEL SMT/DIPlaina
● IQC
● IPQC(ln-process Quality Control)/FAl hoao
● Nānā Kiʻi ma hope o ka reflow umu/AOl
● Nā mea hana CT
● Nānā Kiʻi ma mua o ka hoʻokahe hou ʻana i ka umu
● QA ka nānā ʻole ʻana
● OQC (Ka Mana Mana Kūwaho)
KAPELSMT FACTORY
● Manaʻo Online i nā minuke
● 1-2Days huli wikiwiki pcb hui prototype
● Pane wikiwiki no ke kākoʻo ʻenehana a me ka ʻōlelo aʻo
● Ka nānā 'ana o ka BOM no ka hō'oia 'ana i ka mea
● kūlike a me ka pono ʻikepili
● 7*24 Ka lawelawe mea kūʻai aku ma ka pūnaewele
● Paipai hoʻolako kiʻekiʻe
KAPELHOOLAHA HANA
● Hana ʻia PCB
● Nā ʻāpana ʻawaʻawa
● Hui SMT&PTH
● Papahana, Hoao Hana
● Hui Kaula
● Hoʻopili Kūlike
● Hui Paʻa a me nā mea ʻē aʻe.
CAPEL PCB hiki ke kaʻina hana
| Māhele | Nā kikoʻī | |
| Ka manawa o waena o ka hoʻomaka a i ka wā pau | 24 hola Prototyping, ʻo ka manawa hāʻawi o ka liʻiliʻi liʻiliʻi ma kahi o 5 mau lā. | |
| Ka nui o ka PCBA | SMT patch 2 miliona mau helu / lā, THT 300,000 mau helu / lā, 30-80 kauoha / lā. | |
| Mea lawelawe | Turnkey | Me ka ʻōnaehana hoʻokele waiwai a me ka maikaʻi, lawelawe mākou i nā papahana PCBA me ka hana kiʻekiʻe. ʻO kahi hui o nā ʻenekini kūʻai ʻoihana a me nā limahana kūʻai mākaukau ke kuleana no ka kūʻai ʻana a me ka mālama ʻana i nā ʻāpana no kā mākou mea kūʻai. |
| Hoʻopaʻa ʻia a hoʻopaʻa ʻia paha | Me kahi hui hoʻokele waiwai kūʻai ikaika a me ke kaulahao lako ʻāpana, hāʻawi nā mea kūʻai aku iā mākou i nā ʻāpana, hana mākou i ka hana hui. | |
| Huipuʻu | Hāʻawi ʻia nā ʻāpana a i ʻole nā ʻāpana kūikawā e nā mea kūʻai aku. a me nā ʻāpana waiwai no nā mea kūʻai aku. | |
| ʻAno Kūʻai PCBA | ʻO SMT, THT, a i ʻole nā lawelawe kūʻai ʻana PCBA. | |
| Pākuʻi Kuʻikuʻi/Uea Kina/Paʻa | alakaʻi a alakaʻi ʻole (RoHS compliant) nā lawelawe hana PCBA. A hāʻawi pū i ka paʻi solder maʻamau. | |
| Stencil | ʻokiʻoki laser e hōʻoia i nā ʻāpana e like me nā ICs-pitch liʻiliʻi a me BGA e hālāwai me ka IPC-2 Class a ʻoi aku paha. | |
| MOQ | 1 ʻāpana, akā ke aʻo nei mākou i kā mākou mea kūʻai aku e hana ma kahi o 5 mau laʻana no kā lākou loiloi ponoʻī a hoʻāʻo. | |
| Nui o ka hapa | • Nā ʻāpana passive: maikaʻi mākou i ka hoʻopili ʻana i ka ʻīniha 01005 (0.4mm * 0.2mm), 0201 ia mau mea liʻiliʻi. | |
| • Nā IC kiʻekiʻe e like me BGA: Hiki iā mākou keʻike i nā mea BGA me ka Min 0.25mm spacing e X-ray. | ||
| Pūʻolo Hui | reel, ʻoki lipine, paipu, a me nā pallets no nā mea SMT. | |
| Pono ka mauna kiʻekiʻe loa o nā ʻāpana (100FP) | ʻO 0.0375mm ka pololei. | |
| ʻAno PCB Solderable | PCB (FR-4, metala substrate), FPC, Rigid-flex PCB, Aluminum PCB, HDI PCB. | |
| Papahana | 1－60（papa） | |
| Kaʻina hana kiʻekiʻe | 545 x 622 mm | |
| Ka mānoanoa o ka papa | 4(papa)0.40mm | |
| 6(papa) 0.60mm | ||
| 8(papa) 0.8mm | ||
| 10(papa)1.0mm | ||
| laulā laina liʻiliʻi | 0.0762mm | |
| Kaawale iki | 0.0762mm | |
| ʻAha mechanical liʻiliʻi | 0.15mm | |
| mānoanoa keleawe pā puka | 0.015mm | |
| ʻO ka ʻae ʻana i ka puka metala | ±0.05mm | |
| Aperture non-metala | ±0.025mm | |
| Hoʻomanawanui lua | ±0.05mm | |
| Ka hoʻomanawanui ʻana | ±0.076mm | |
| Alahaka kūʻai liʻiliʻi | 0.08mm | |
| Kūleʻa hoʻokaʻawale | 1E+12Ω(maʻamau) | |
| Lakiō mānoanoa o ka pā | 1:10 | |
| Haʻalulu wela | 288 ℃（4 manawa i 10 kekona） | |
| Hoʻokaʻawale a piko | ≤0.7% | |
| Ka ikaika anti-electricity | ＞1.3KV/mm | |
| Ka ikaika anti-stripping | 1.4N/mm | |
| Kūʻai kūʻai i ka paʻakikī | ≥6H | |
| Hoʻopaʻa ahi | 94V-0 | |
| Ka hoʻomalu impedance | ±5% | |
| Hōʻano waihona | BOM, PCB Gerber, koho a wahi. | |
| Ke hoao ana | Ma mua o ka hoʻouna ʻana, e hoʻohana mākou i nā ʻano hoʻokolohua like ʻole i ka PCBA ma ka mauna a i ʻole ka mauna: | |
| • IQC: incoming inspection; | ||
| • IPQC: in-production inspection, LCR test for the first piece; | ||
| • QC Nānā: nānā i ka maikaʻi maʻamau; | ||
| • AOI: ka hopena kūʻai ʻana o nā ʻāpana ʻāpana, nā ʻāpana liʻiliʻi a i ʻole ka polarity o nā ʻāpana; | ||
| • X-Ray: nānā i ka BGA, QFN a me nā mea kikoʻī kiʻekiʻe ʻē aʻe i hūnā ʻia nā mea PAD; | ||
| • Ho'āʻo Hana: Ho'āʻo i ka hana a me ka hana e like me nā kaʻina hana hoʻokolohua a ka mea kūʻai aku e hōʻoia i ka hoʻokō. | ||
| Hoʻoponopono a hana hou | Hiki i kā mākou lawelawe hoʻoponopono BGA ke wehe palekana i kahi kuhi hewa ʻole, kahi kūlana, a hoʻopunipuni i ka BGA a hoʻopili hou iā lākou i ka PCB maikaʻi loa. | |
CAPEL FPC & Flex-Rigid PCB hiki ke kaʻina hana
| Huahana | Kiekie Kiekie | |||
| Hoʻohui (HDI) | ||||
| Flex kaapuni maʻamau Flex | Nā Kaapuni Paʻa Paʻa | Kaapuni Flex paakiki | Hoʻololi Membrane | |
| Nui Panel maʻamau | 250mm X 400mm | Roll fomat | 250mmX400mm | 250mmX400mm |
| ka laula laina a me ka Spacing | 0.035mm 0.035mm | 0.010" (0.24mm) | 0.003" (0.076mm) | 0.10" (.254mm) |
| Mānoanoa keleawe | 9um / 12um / 18um / 35um / 70um / 100um / 140um | 0.028mm-.01mm | 1/2 oz.a oi aku | 0.005"-.0010" |
| Ka helu papa | 32 | hoʻokahi | 32 | A hiki i 40 |
| VIA / DRILL SIZE | ||||
| ʻO ke anawaena puka liʻiliʻi (Mechanical). | 0.0004" ( 0.1 mm ) 0.006" ( 0.15 mm ) | N / A | 0.006" ( 0.15 mm) | 10 mil (0.25 mm) |
| Ka liʻiliʻi ma Via ( Laser ) Nui | 4 mil ( 0.1mm ) 1 mil ( 0.025 mm ) | N / A | 6 mili ( 0.15 mm ) | N / A |
| Ka liʻiliʻi liʻiliʻi Micro Via ( Laser ) Nui | 3 mili (0.076 mm ) 1 mili ( 0.025 mm ) | N / A | 3 mili (0.076 mm) | N / A |
| Mea Paʻa Paʻa | Polyimide / FR4 / Metal / SUS / Alu | PET | FR-4 / Poyimide | PET / Metala/FR-4 |
| Mea pale | Copper / kala Lnk / Tatsuta / Carbon | Pepa Kālā/Tatsuta | Ke keleawe / Inika Kālā/Tatduta / Carbon | Pepa Kālā |
| Mea Paahana | 2 mil ( 0.051 mm ) 2 mil ( 0.051 mm ) | 10 mil (0.25mm) | 2 mili (0.51 mm) | 5 mil ( 0.13 mm ) |
| Zif Hoʻomanawanui | 2 mili ( .051 mm ) 1 mili ( 0.025 mm ) | 10 mil (0.25mm) | 2 mili (0.51 mm) | 5 mil ( 0.13 mm ) |
| MAKEMAKE KUAI | ||||
| Uku Alahaka Solder Mask ma waena o Dam | 5 mil (.013 mm) 4 mil (0 .01mm) | N / A | 5 mil ( 0.13 mm ) | 10 mil (0.25mm) |
| Hoʻomanawanui Hoʻopaʻa inoa Solder Mask | 4 mil (.010 mm) 4 mil(0.01mm) | N / A | 5 mil ( 0.13 mm ) | 5 mil ( 0.13 mm ) |
| HOOPUHI | ||||
| Kakau inoa Coverlay | 8 mil 5 mil | 10 mil | 8 mil | 10 mil |
| Kakau inoa PIC | 7 mil 4 mil | N / A | 7 miliona | N / A |
| Hoʻopaʻa inoa Solder Mask | 5 mil 4 mil | N / A | 5 mil | 5 mil |
| Hoʻopau ʻili | ENIG/Kālā Kaiapuni/Pina Kaiapuni/Paʻi gula/Paʻi ʻīniha/OSP/ ENEPIG | |||
| Kaao | ||||
| Kiʻekiʻe liʻiliʻi | 35 mil 25 mil | 35 mil | 35 mil | Kaulana kiʻi |
| Ka laulā liʻiliʻi | 8 mil 6 mil | 8 mil | 8 mil | |
| Wahi liʻiliʻi | 8 mil 6 mil | 8 mil | 8 mil | |
| Kakau inoa | ±5mil ±5mil | ±5mil | ±5mil | |
| Ka hoʻopalekana | ±10% ±10% | ±20% | ±10% | NA |
| SRD ( Make Rula kila ) | ||||
| Hoʻomanawanui Outline | 5 mil ( 0.13 mm ) 2 mil ( 0.051 mm ) | N / A | 5 mil ( 0.13 mm ) | 5 mil ( 0.13 mm ) |
| radius liʻiliʻi | 5 mil ( 0.13 mm ) 4 mil ( 0.10 mm ) | N / A | 5 mil ( 0.13 mm ) | 5 mil ( 0.13 mm ) |
| Loko Radius | 20 mil ( 0.51 mm ) 10 mil ( 0.25 mm) | N / A | 31 mil | 20 mil ( 0.51 mm ) |
| Puʻu i ka liʻiliʻi loa o ka lua | 40 mil ( 10.2 mm ) 31.5 mil ( 0.80 mm) | N / A | N / A | 40 mil (1.02 mm ) |
| ʻO ka hoʻomanawanui o ka nui o ka Punch Hole | ± 2mil (0.051 mm) ± 1 mil | N / A | N / A | ± 2 mil ( 0.051 mm ) |
| Laulā ʻĀpana | 20 mil ( 0.51 mm ) 15 mil ( 0.38 mm ) | N / A | 31 mil | 20 mil ( 0.51 mm ) |
| Hoʻomanawanui o ka puka e outline | ±3 mil ± 2 mil | N / A | ±4 mil | 10 mil |
| ʻO ka ʻae ʻana o ka ʻaoʻao o ka lua i ka outline | ±4 mil ± 3 mil | N / A | ±5 mil | 10 mil |
| Ka liʻiliʻi o ka Trace i ka outline | 8 mil 5mil | N / A | 10 mil | 10 mil |
