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Hoʻonui i kāu hana PCB: koho i ka hoʻopau kūpono no kāu papa 12-layer

Ma kēia moʻomanaʻo, e kūkākūkā mākou i kekahi mau lāʻau lapaʻau kaulana a me kā lākou mau pono e kōkua iā ʻoe e hoʻomaikaʻi i kāu kaʻina hana 12-layer PCB.

Ma ke kahua o nā kaapuni uila, paʻi ʻia nā papa kaapuni (PCBs) i mea koʻikoʻi i ka hoʻopili ʻana a me ka hoʻoikaika ʻana i nā ʻāpana uila.Ke holomua nei ka ʻenehana, piʻi nui ka noi no nā PCB holomua a paʻakikī.No laila, ua lilo ka hana PCB i mea koʻikoʻi i ka hana ʻana i nā mea uila kiʻekiʻe.

Hoʻohana ʻia ka 12 layer FPC Flexible PCB i ka Medical Defibrillator

ʻO kahi mea nui e noʻonoʻo ai i ka wā hana PCB ʻo ka hoʻomākaukau ʻana i ka ʻili.ʻO ka mālama ʻana i ka ʻili e pili ana i ka uhi ʻana a i ʻole ka hoʻopau ʻana i hoʻopili ʻia i kahi PCB e pale aku iā ia mai nā kumu kūlohelohe a hoʻonui i kāna hana.Loaʻa nā ʻano koho lapaʻau i loaʻa, a ʻo ke koho ʻana i ka lapaʻau kūpono no kāu papa 12-layer hiki ke hoʻololi nui i kāna hana a me ka hilinaʻi.

1.HASL (wela ea solder leveling):
ʻO ka HASL kahi ʻano hana lapaʻau i hoʻohana nui ʻia e pili ana i ke kaomi ʻana i ka PCB i loko o ka solder hoʻoheheʻe a laila hoʻohana i ka pahi ea wela e wehe i ka solder keu.Hāʻawi kēia ʻano hana i kahi hopena kūpono me ka solderability maikaʻi loa.Eia naʻe, aia kekahi mau palena.ʻAʻole hiki ke māhele like ʻia ka solder ma luna o ka ʻili, e hopena i ka pau ʻole.Eia kekahi, ʻo ka hoʻolaha ʻana i ka wela kiʻekiʻe i ka wā o ke kaʻina hana hiki ke hoʻoulu i ke kaumaha wela ma ka PCB, e pili ana i kona hilinaʻi.

2. ENIG (gula immersion nickel electroless):
He koho kaulana ʻo ENIG no ka mālama ʻana i ka ʻili ma muli o kāna weldability maikaʻi loa a me ka palahalaha.Ma ke kaʻina hana ENIG, waiho ʻia kahi ʻāpana nickel lahilahi ma ka ʻili keleawe, a ukali ʻia e kahi ʻāpana gula lahilahi.Mālama kēia hoʻomaʻamaʻa i ka pale ʻana i ka oxidation maikaʻi a pale i ka pōʻino o ke keleawe.Eia kekahi, ʻo ka hāʻawi like ʻana o ke gula ma luna o ka ʻili e hāʻawi i kahi ʻili palahalaha a maʻalahi, e kūpono ai i nā ʻāpana kiʻi maikaʻi.Eia naʻe, ʻaʻole ʻōlelo ʻia ʻo ENIG no nā noi alapine kiʻekiʻe ma muli o ka nalowale ʻana o ka hōʻailona ma muli o ka papa pale nickel.

3. OSP (mea mālama ola kino):
He ʻano hana lapaʻau ʻili ʻo OSP e pili ana i ka hoʻopili pono ʻana i kahi ʻāpana organik lahilahi i ka ʻili keleawe ma o ka hopena kemika.Hāʻawi ʻo OSP i kahi hopena maikaʻi a pili i ke kaiapuni no ka mea ʻaʻole ia e koi i nā metala kaumaha.Hāʻawi ia i kahi ʻili palahalaha a maʻalahi e hōʻoia i ka solderability maikaʻi loa.Eia nō naʻe, paʻakikī nā pale OSP i ka makū a koi i nā kūlana mālama kūpono e mālama i ko lākou kūpaʻa.ʻOi aku ka maʻalahi o nā papa i mālama ʻia e OSP i nā ʻōpala a me ka mālama ʻana i nā pōʻino ma mua o nā lāʻau lapaʻau ʻē aʻe.

4. Ke kala kaiapuni:
ʻO ke kālā immersion, ʻike ʻia hoʻi ʻo ke kālā immersion, he koho kaulana ia no nā PCB kiʻekiʻe ma muli o kona conductivity maikaʻi a me ka poho hoʻokomo haʻahaʻa.Hāʻawi ia i kahi pālahalaha, ʻili laulima e hōʻoia i ka solderability hilinaʻi.ʻOi aku ka maikaʻi o ke kālā immersion no nā PCB me nā ʻāpana pitch maikaʻi a me nā noi kiʻekiʻe.Eia nō naʻe, ʻano ʻino nā ʻili kālā i nā wahi haʻahaʻa a koi i ka mālama pono ʻana a me ka mālama ʻana e mālama i ko lākou kūpaʻa.

5. Paʻa gula paʻa:
ʻO ka paʻi gula paʻa ka waiho ʻana i kahi ʻāpana gula mānoanoa ma ka ʻili keleawe ma o ke kaʻina hana electroplating.Mālama kēia ʻili i ka conductivity uila maikaʻi loa a me ka pale ʻana i ka corrosion, kūpono ia no nā noi e koi ana i ka hoʻokomo pinepine ʻana a me ka wehe ʻana i nā ʻāpana.Hoʻohana mau ʻia ka pale gula paʻa i nā mea hoʻohui lihi a me nā hoʻololi.Eia nō naʻe, ʻoi aku ka kiʻekiʻe o ke kumukūʻai o kēia lapaʻau i hoʻohālikelike ʻia me nā lāʻau lapaʻau ʻē aʻe.

Ma ka hōʻuluʻulu, ʻO ke koho ʻana i ka hoʻopau ʻili maikaʻi no kahi PCB 12-layer he mea koʻikoʻi i kāna hana a me ka hilinaʻi.Loaʻa i kēlā me kēia koho lapaʻau i kona mau pono a me nā palena, a ʻo ke koho e pili ana i kāu koi noi kikoʻī a me kāu kālā.Inā ʻoe e koho i ke kumu kūʻai ʻoi aku ka maikaʻi, ke gula kaiapuni hilinaʻi, ka OSP pili i ke kaiapuni, ke kala kaiapuni kiʻekiʻe, a i ʻole ka paʻi gula paʻakikī, ʻike i nā pono a me nā noʻonoʻo no kēlā me kēia lapaʻau e kōkua iā ʻoe e hoʻomaikaʻi i kāu kaʻina hana PCB a hōʻoia i ka holomua o kou lako uila.


Ka manawa hoʻouna: Oct-04-2023
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